Con il comunciato per la stampa di seguito allegato, VIA Technologies ha annunciato il suo nuovo form factor per motherboard destinate alla realizzazione di sistemi embedded: l'Em-ITX. Questo form factor implementa lo standard omonimo definito dalla stessa VIA e mira a divenire nel tempo un riferimento per gli sviluppatori di sistemi dalle dimensioni particolarmente ridotte.
In accordo al produttore, le sue dimensioni (12cm x 17cm) sono inferiori di circa il 30% a quelle del Mini-ITX ed offre il pieno supporto di tutte le tecnologie che VIA ha lanciato di recente per l'ambito delle unità low-power. In particolare, Em-ITX può gestire i processori Nano a 64-bit; inoltre il suo bus (Em-IO) può essere utilizzato per agganciare la gran parte delle tecnologie diffuse con altri form factor, come USB 2.0, GPIO, LPC, PCIe, IDE, IEEE 1394, S-ATA, PCI, DVI, HDMI, Gigabit Ethernet e Card Bus.
I primi sistemi basati su Em-ITX saranno commercializzati a partire dal mese di Aprile.
Taipei, Taiwan, 3 March 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced its latest board form factor for embedded system developers; the Em-ITX form factor. Offering embedded developers a compact, versatile and highly integrated board form factor, VIA's Em-ITX establishes an off-the-shelf standard for ultra-slim embedded devices.
The Em-ITX form factor is a new open industry standard defined by VIA, and is 30% more compact than Mini-ITX, yet offers 200% more I/O real estate. At 12cm x 17cm, the Em-ITX form factor includes unique dual I/O coastlines and an exclusive Em-IO expansion bus to bring unrivalled flexibility and scalability. Benefits also include reduced time-to-market cycles for developers and access to a scalable processor platform that includes the latest 64-bit VIA Nano processor.
Embedded boards based on the Em-ITX form factor will form the ideal base for industrial automation, digital signage, kiosk and other applications requiring an ultra-slim embedded device.
Dual I/O Coastlines
The VIA developed Em-ITX form factor specification includes dual I/O coastlines; I/O inputs can be found on both 17cm edges of the board. This unique design greatly reduces cable clutter facilitating even more compact and robust designs while also boosting signal integrity and improving airflow. A variety of connectors are available on these two I/O coastlines, including COM (RS-232/422/485), RJ45, DVI, VGA, LVDS, USB 2.0 and DC power signals.
Modular Expansion through Em-IO Bus
The Em-ITX form factor utilizes the Em-IO expansion bus to integrate with stackable, customizable, expansion modules. The Em-IO expansion bus integrates the majority of popular bus signal technologies, including USB 2.0, GPIO, LPC, PCIe, IDE, IEEE 1394, S-ATA, PCI, DVI, HDMI, Gigabit Ethernet and Card Bus signals.
Faster Time to Market Cycles
VIA has also designed a selection of expansion modules covering a variety of industrial applications including networked applications, multimedia display, kiosk, POI and POS applications. The expansion modules bring all the advantages of custom designed boards without the necessary development time. VIA also provides unrivalled software support including customized firmware implementations.
"VIA is known globally as a pioneer of small form factor boards that have become industry standards, and Em-ITX is the latest platform to address the evolving needs of embedded developers," said Daniel Wu, Vice President, VIA Embedded, VIA Technologies, Inc. "With its extensive I/O accessibility, this innovative form factor can deliver ultra-slim systems or customized stacked systems for a wide range of embedded applications."
Products based on the Em-ITX form factor will be available early next month.
For more details about the Em-ITX form factor please visit:
http://www.via.com.tw/en/initiatives/spearhead/em-itx/index.jsp
A white paper with more details on this new form factor is available here:
http://www.via.com.tw/en/downloads/whitepapers/
A demo featuring forthcoming Em-ITX based products will be shown at Embedded World 2009 in Germany this week. For more details, please visit the VIA website at:
http://www.via.com.tw/en/company/events/2009-ew/index.jsp
News Source: VIA Press Release
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